Course description:
Danish title: Mikrofabrikation i renrummet/MICRO 1
English title: Cleanroom micro fabrication/MICRO 1
Credits: 5 ECTS
Prerequisites: MECH1, ESY, EPHYS, ELEC
Aim:
Upon completing this course, the students will have a general knowledge of various micro fabrication techniques and will be able to follow the design of a micro fabrication process including process recipe development, mask design, and micro system fabrication and characterisation.
Competences:
At the end of the course, the student is expected to be able to
- Account for the structure and properties of silicon and the reason for its large prevalence.
- Describe the photolithographic process and compare its characteristics to alternative lithography techniques such as electron beam lithography and nanoimprint lithography.
- Explain the process of formation of silicon dioxide by thermal oxidation and be able to use a theoretical model to predict the thickness of the resulting silicon dioxide layer.
- Account for the most commonly used chemical and physical vapor deposition techniques, describe their operation principles and account for which materials that can be deposited.
- Describe both wet and dry etching methods and account for the pros and cons.
Subjects covered:
1. Cleanroom technology
2. Silicon
a. Crystal structur
b. Wafer types and properties (sizes, crystal orientations, doping type and concentration, special types – silicon-on-insulator (SOI))
3. Growth and deposition of thin films
a. Growth of silicon dioxide on silicon by thermal oxidation
b. Deposition of thin films by chemical vapor deposition (CVD)
i. Low pressure CVD
ii. Plasma enhanced CVD
c. Deposition of thin films by physical vapor deposition
i. Evaporation
ii. Sputtering
4. Lithography techniques for pattern definition
a. Photo lithography
b. Electron beam lithography
5. Etching
a. Wet etching
i. Isotropic etching
ii. Anisotropic etching (etching of silicon in KOH)
b. Dry etching (reactive ion etching)
Evaluation:
Oral exam: Danish 7 mark scale, internal examiner, exam protocol required
Remarks regarding evaluation:
Examination based on content of lectures and lab exercises
Withdrawal: 7 days
Teaching methods:
Lectures, 8 hours
Laboratory exercises, 22 hours
The course takes place in the autumn semester.
It is compulsory in the following curricula: Mechatronics, specialisation nanotechnology.
Valid from: September 2009
Teacher: Jakob Kjelstrup-Hansen
Books:
J. D. Plummer, M. D. Deal, and P. B. griffin: Silicon VLSI Technology, Prentice Hall, 2000, ISBN 0-13-085037-3