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Space and Security

Research area · SDU Microelectronics

The chip for space and security group develops integrated circuits that combine hardware security, physical resilience, and environmental robustness for spaceborne and other mission-critical systems.

Research focus

Our goal is silicon-secure, silicon-reliable electronics that preserve data integrity, confidentiality, and operational stability under extreme conditions. We pursue this through three layers.

Cryptographic layer

TRNGs and PUFs for secure key generation, device authentication, and protection against counterfeiting.

Physical-resilience layer

Protects the cryptographic layer and other sensitive circuits from EMI injection, side-channel leakage, and tampering or probing.

Environmental-robustness layer

Ensures reliable function under radiation, temperature extremes, and aging through radiation-hardened, temperature-compensated, fault-tolerant ICs.

Subsystems

All subsystems are designed to maintain both security and performance over long-term missions.

Sensor interfacesSecure acquisition at the edge of the system
Power-management unitsStable supply under radiation and temperature extremes
Communication transceiversProtected links over long-term missions

Bridging security and reliability

By combining these layers, the group bridges hardware security with IC reliability to deliver trustworthy electronics for space, defense, and high-security applications.

Chip for space and security applications.
Chip for space and security applications.

Contact

Contact the research area

Professor Farshad Moradi

Head of SDU Microelectronics

moradi@sdu.dk +45 5386 9444

Last Updated 24.08.2026