The chip for space and security group develops integrated circuits that combine hardware security, physical resilience, and environmental robustness for spaceborne and other mission-critical systems. Our goal is silicon-secure, silicon-reliable electronics that preserve data integrity, confidentiality, and operational stability under extreme conditions. We pursue this through three layers: a cryptographic layer using TRNGs and PUFs for secure key generation, device authentication, and protection against counterfeiting; a physical-resilience layer that protects the cryptographic layer and other sensitive circuits from EMI injection, side-channel leakage, and tampering or probing; and an environmental-robustness layer that ensures reliable function under radiation, temperature extremes, and aging through radiation-hardened, temperature-compensated, fault-tolerant ICs. All subsystems, including sensor interfaces, power-management units, and communication transceivers, are designed to maintain both security and performance over long-term missions. By combining these layers, the group bridges hardware security with IC reliability to deliver trustworthy electronics for space, defense, and high-security applications.
Chip for Space and Security Applications