LABS

Structural test lab

High resolution imaging of non-organic and organic materials and their composite structures with high contrast and without charging artefacts.

Description/Services for companies

 
  • High resolution imaging of non-organic and organic materials and their composite structures with high contrast and without charging artefacts.
  • Sub-10nm nanostructures fabrication – for lithography, photonics/plasmonics etc.
  • Electrical measurements - sample conductivity, resistance etc.
  • Non-destructive reconstruction of internal microstructure of objects as largeas >300 mm in diameter as well submicron resolution for smaller samples.
  • Energy-dispersive X-ray (EDX) material analysis for quantitative analysis of samples providing detailed information of a sample’s chemical composition.
X-ray image of a capacitor with defect contact

     

Technical specification of equipment

 
Helium ion microscope Zeiss ORION NanoFab
  • Helium ion beam resolution: 0.5 nm @ 30 kV; beam energy: 10 – 30 kV
  • Neon ion beam resolution: 1.9 nm @ 25 kV; beam energy: 10 – 25 kV
  • Gallium FIB resolution: 3 nm @ 30 kV; beam energy: 1 – 30 kV
Atomic force microscope Nanonics MultiView 4000
  • Scan resolution: <0.05 nm (Z), <0.15 nm (XY).
  • Scan range: up to 130 microns (XYZ) with sample & probe scanning.
  • Sample size: up to 34 mm, up to 70 grams.
X-Ray nanotomograph Bruker SkyScan 2214
  • Scan resolution: <120 nm (pixel size), <500 nm (low-contrast spatial resolution, >10% MTF).
  • X-Ray source: 20-160 kV with W filament, 20-100 kV with LaB6 filament, up to 16 W.
  • Sample size: up to 300 mm in diameter, up to 400 mm in length, up to 25 kg.
Scanning electron microscope Hitachi S-4800
  • Scan resolution: 2 nm @ 1 kV; 1 nm @ 15 kV
  • Sample size: up to 110 mm in diameter, up to 17 mm in height.

Contact

Vadzim Adashkevich
Electrical Engineer
Centre for Industrial Electronics (CIE)
Mads Clausen Institute

T +45 4552 1666
vadzim@mci.sdu.dk