Research areas

Along the general aim of establishing world class research and a powerful ecosystem within industrial electronics, CIE will excel in a series of special topics, from advanced power electronics to digital electronics and sophisticated actuators.

The envisioned excellence of CIE will be realized by state-of-the-art research and development in:

SiC and GaN: materials for the components of the future

  • Atomic Layer Deposition of  WBG films for better defect control 
  • Development of new design architectures 
  • Reliability and lifetime studies 
  • Integration of components into systems 
  • Focus on components for automotive industry 
  • Focus on converter technology

Bonding, packaging & cooling: advanced technologie

  • New packaging methods 
  • New bonding methods 
  • New cooling methods including advanced liquid (multiphase) and solid state cooling 
  • Cooling applications for power electronics system development including motor drives for large compressor-control, solar inverters, power stacks for wind turbine applications and inverters for electric and hybrid vehicles

Motor drives for a green future: research, development and test

  • Multilevel drive topologies and circuit concepts for improved system efficiency and cost reduction
  • Complete system modelling and control design
  • Combination testing of high efficiency, sustainable and cost-effective motor drives and converters
  • Scalable and modular design for circular economy
  • Combination test of motor families and converters/drives

Failures, faults and reliability: lifetime tests and microanalysis of breakdowns

  • Fast variable and cross-coupled parameter accelerated lifetime testing of individual components and small systems
  • Reliability of PE components and devices, including new semiconductor components
  • Reliability test of packaging methods and microelectromechanical systems (MEMS)
  • Chip thermography and measurement of switch losses
  • Multiple environment over stress testing. Stressors: vibration, temperature, humidity, EM emissions
  • HALT (highly accelerated lifetime) and HASS (highly accelerated stress screen) tests 
  • Tomographic failure analysis at component level
  • Fast analysis at system level via combined modelling and measurements: model based fault analysis

EMC and EMI: quantitative testing and fast product improvement

  • EM (electromagnetic) emission noise reduction for small and medium-sized electronic equipment
  • EMC (electromagnetic compatibility) and EMI (electromagnetic immunity) improvement of coexisting equipment for avoiding interference
  • Conducted and radiated emission testing for line filter design

Smart devices of the future: Local digital control vs. cloud control

  • Advanced control systems and their reliability
  • Automated design of electronics based on control theories
  • Cloud control 
  • Adaptive learning strategies including cooperative control and estimation
  • Printed electronics

Smart actuators: flexible and with embedded intelligenceLinear actuators 

  • Vibration and reliability measurements
  • Embedded intelligence-controlled actuators
  • Soft and polymer actuators
  • Dielectric elastomer based printed devices

Silencing the apparatus: machine noise quantification and elimination

  • Measurement and certification of noise level
  • Sound design of devices and machines
  • Advanced measurement and prediction of complex sound fields in production environments

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